E. Hamciuc et al., POLY(BENZIMIDAZOLE-IMIDE-AMIDE)S CONTAINING HEXAFLUOROISOPROPYLIDENE UNITS, Die Angewandte makromolekulare Chemie, 210, 1993, pp. 143-150
New poly(benzimidazole-imide-amide)s containing hexafluoroisopropylide
ne units in the backbone have been synthesized by polycondensation of
diaminobenzimidazoles with novel diacid dichlorides which incorporated
both imide and hexafluoroisopropylidene groups. These polymers have h
igh thermal stability and low dielectric constant and are soluble in p
olar aprotic solvents giving transparent, flexible films by casting th
eir solutions. Such properties make them attractive for applications a
s dielectric coatings in microelectronics.