C. Monteil et al., REALIZATION OF CAPACITIVE STRUCTURES FROM PLASMA-ENHANCED CHEMICAL-VAPOR-DEPOSITION PROCESS, Materials science & engineering. B, Solid-state materials for advanced technology, 21(1), 1993, pp. 41-48
Multilayer structures metal-insulator-metal are deposited on tungsten
wires in view to realize capacitive systems. Both metal and insulator
layers are formed in the same reactor by a glow discharge gas phase de
composition under a frequency of 35 kHz and a temperature of 375-degre
es-C. The materials chosen are tungsten and silicon nitride. Tungsten
silicide is deposited as an interphase layer for the lack of adhesion
of tungsten to silicon nitride. X-ray diffraction, AES and XPS studies
show that tungsten films consists of pure phase alpha with no evidenc
e for incorporation of oxygen. Resistivity measurements on tungsten fi
lms exhibit a bulk material resistivity of 20 muOMEGA cm. The adhesion
layer consists of WSi2 material with a hexagonal crystalline structur
e having a resistivity of 560 muOMEGA cm. Silicon nitride is a near st
oichiometric material as deduced from AES spectra. Capacitance values
versus insulator thickness were measured on cylindrical structures and
showed a good fit between results and theory.