K. Wu et al., THE INFLUENCE OF FINITE CONDUCTOR THICKNESS AND CONDUCTIVITY ON FUNDAMENTAL AND HIGHER-ORDER MODES IN MINIATURE HYBRID MICS (MHMICS) AND MMICS, IEEE transactions on microwave theory and techniques, 41(3), 1993, pp. 421-430
This paper presents a rigorous analysis of the effect of finite metall
ization thickness and finite conductivity on the propagation character
istics of conductor-backed CPW on thin substrate. A self-consistent ap
proach is used together with the method of lines (MoL) to determine th
e propagation constant, losses and field distribution of the fundament
al and first two higher-order modes in CPW's with finite metallization
thickness and lossy backmetallization. The method used is general and
can be applied to miniature MIC's (MHMIC) and MMIC's including lossy
semiconductor substrate. It is shown that the onset of higher order mo
des limits the usable frequency range of conductor backed CPW. The ana
lysis includes also microstrip transmission lines on thin substrate ma
terial. It is demonstrated that a resistive strip embedded into the mi
crostrip groundplane may potentially be useful in the design of integr
ated planar attenuators.