In this paper it is shown for the first time how the characteristics o
f the corner MOSFET inherent to trench isolation can be extracted from
hardware measurements and how the corner device must be taken into ac
count when extracting MOSFET channel characteristics. For NFET's it is
found that the corner's threshold voltage, substrate sensitivity, and
sensitivity to well doping are all smaller than the channel's. The re
sults imply that for low standby power logic applications requiring hi
gh performance, it may become necessary to locally control the well do
ping at the corner. However, the corner's reduced substrate sensitivit
y and width independence can provide a significant advantage in a DRAM
cell.