Rp. Tye et A. Maesono, CHARACTERIZATION AND THERMAL-PROPERTIES EVALUATION OF THIN-FILMS, WAFERS AND SUBSTRATES, Thermochimica acta, 218, 1993, pp. 155-172
Materials in use or under consideration for many applications in new a
nd emerging technologies are often available only in small quantities
and many times in the form of thin films, wafers and sheets. Such size
and form limitations present a number of challenges to diose wishing
to evaluate thermal performance characteristics. This has resulted in
a need to develop totally new transient or modify current transient an
d steady state techniques. Various new or modified techniques to measu
re the thermal diffusivity, thermal conductivity, specific heat and th
ermal expansion over broad temperature ranges will be described. Illus
trations of applications to and results on semiconductors, superconduc
tors, diamonds, polymers, composites and layered structures will be gi
ven and discussed.