A NEW METHOD FOR MEASURING THE STRENGTH AND DUCTILITY OF THIN-FILMS

A new method of measuring the mechanical strength of thin films is des cribed. We prepare miniature arrays of four tensile specimens, each 0. 25 mm wide, 1 mm long, and 2.2 mum thick, using deposition, patterning , and etching processes common to the semiconductor industry. Each arr ay of four specimens is carried on and protected by a rectangular sili con frame. Thirty-six such specimens are produced on a single wafer. A fter a specimen frame is mounted, its vertical sides are severed witho ut damaging the specimens. The load is applied by micrometers through a special tension spring. Tensile properties of a 2.2 mum thick Ti-Al- Ti film were determined.