AN APPLICATION OF A FLIP-CHIP-BONDING TECHNIQUE TO GHZ-BAND SAW FILTERS FOR MOBILE COMMUNICATION

Authors
ONISHI K SEKI S TAGUCHI Y BESSHO Y EDA K ISHIDA T
Citation
K. Onishi et al., AN APPLICATION OF A FLIP-CHIP-BONDING TECHNIQUE TO GHZ-BAND SAW FILTERS FOR MOBILE COMMUNICATION, IEICE transactions on electronics, E76C(6), 1993, pp. 993-999
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
IEICE transactions on electronics → ACNP
ISSN journal
09168524
Volume
E76C
Issue
6
Year of publication
1993
Pages
993 - 999
Database
ISI
SICI code
0916-8524(1993)E76C:6<993:AAOAFT>2.0.ZU;2-L
Abstract
We applied a filip-chip-bonding technique to GHz-band SAW filters. The SAW filters mounted by the stud-bump-bonding (SBB) technique which is a kind of flip-chip-bonding technique showed almost the same frequenc y characteristics as those mounted by the conventional wire-bonding te chnique at 1.5 GHz. The SAW filter configuration, fabrication process using the SBB, and its electrical characteristics are described and di scussed. The SBB technique has a lot of potential to reduce the size a nd weight even above GHz frequencies.