Ds. Boyle et al., DIRECT EVIDENCE FOR THE FORMATION OF A PASSIVATING LAYER DURING CHEMOMECHANICAL POLISHING OF SILICA BY A HYDROGEN DIFLUORIDE-BASED REAGENT, Journal of materials chemistry, 3(8), 1993, pp. 903-904
The sparingly soluble material (the passivating layer) formed during c
hemomechanical polishing of silica wafers by [HF2]--cerium(IV) oxide-s
ucrose mixtures at low pH has been identified as K2SiF6 coated with a
thin silica layer.