The curing behavior of epoxy resins prepared by reacting epichlorohydr
in with 4,4'-diaminodiphenyl methane (DADPM)/4,4'-diaminodiphenyl ethe
r (DADPE) or 4,4'-diaminodiphenyl sulfone (DDS) was investigated using
DDS and tris- (m-aminophenyl) phosphine oxide (TAP) as curing agents.
A broad exothermic transition with two maxima were observed in the te
mperature range of 100-315-degrees-C when TAP was used as the curing a
gent. The effect of varying DDS concentration on curing behavior of ep
oxy resin was also investigated. Peak exotherm temperature (T(exo)) de
creased with increasing concentration of DDS, whereas heat of curing (
DELTAH) increased with an increase in amine concentration up to an opt
imum value and then decreased. Thermal stability of the resins, cured
isothermally at 200-degrees-C for 3 h, was investigated using thermogr
avimetric analysis in a nitrogen atmosphere. Glass fiber-reinforced mu
ltifunctional epoxy resin laminates were fabricated and the mechanical
properties were evaluated. (C) 1993 John Wiley & Sons, Inc.