JUNCTION LEAKAGE DUE TO COSI2 FORMATION ON AS-DOPED POLYSILICON

Citation
Jp. Gambino et B. Cunningham, JUNCTION LEAKAGE DUE TO COSI2 FORMATION ON AS-DOPED POLYSILICON, Journal of the Electrochemical Society, 140(9), 1993, pp. 2654-2658
Citations number
20
Categorie Soggetti
Electrochemistry
ISSN journal
00134651
Volume
140
Issue
9
Year of publication
1993
Pages
2654 - 2658
Database
ISI
SICI code
0013-4651(1993)140:9<2654:JLDTCF>2.0.ZU;2-0
Abstract
Junction leakage has been observed for shallow diodes that simulate em itter-base junctions in npn bipolar transistors, due to CoSi2 formatio n on As-doped polysilicon. The leakage depends on the Co thickness, th e polysilicon thickness, and the device area, but is relatively indepe ndent of the Co anneal conditions between 600 and 800-degrees-C. Sever e roughness at the CoSi2-polysilicon interface is also observed, espec ially after annealing at 800-degrees-C. The leakage is probably due to CoSi2 protrusions in the substrate that are produced during the initi al silicide formation.