Ac. Dillon et al., DECOMPOSITION OF SILICON HYDRIDES FOLLOWING DISILANE ADSORPTION ON POROUS SILICON SURFACES, Surface science, 295(1-2), 1993, pp. 120000998-120001004
Disilane (Si2H6) is used for silicon chemical vapor deposition (CVD) a
nd is a potential precursor for atomic layer epitaxy (ALE) on silicon
surfaces. In this study, Fourier transform infrared (FTIR) transmissio
n spectroscopy was employed to examine the adsorption and decompositio
n of disilane on high surface area Porous silicon surfaces. The FTIR s
pectra revealed that disilane dissociatively adsorbs on porous silicon
surfaces at 200 K to form a large fraction of SiH3 surface species an
d some SiH2 and SiH surface species. The Si-H(x) stretching modes betw
een 2125-2156 cm-1, the SiH3 degenerate deformation mode at 862 cm-1 a
nd the Si-H2 scissor mode at 907 cm-1 were then employed to monitor th
e decomposition of the surface hydride species during thermal annealin
g. Between 200-600 K, the SiH3 Species decreased and were depleted fro
m the silicon surface. Concurrently, the SiH2 surface species were obs
erved to increase between 200-440 K and subsequently to decrease betwe
en 440-620 K. Only monohydride species remained on the porous silicon
surface at 620 K. Above 640 K, the SiH surface species decreased concu
rrently with H-2 desorption. Adsorption studies were also conducted at
various isothermal temperatures. These disilane adsorption and decomp
osition experiments provide important insights to the surface chemistr
y during silicon CVD and ALE processing.