Cold plasma chemistry can be used for surface modification and/or graf
ting of polymeric substrates for enhanced properties. In addition to i
nteraction with the substrate, plasma reactions can also occur at othe
r surfaces confined to the reactor. Contamination of polypropylene (PP
) substrates with silicon, originating from the reactor walls in a BCl
3 plasma, has been shown to occur based on ESCA measurements and the p
resence of Si-based compounds in the gaseous phase has been shown by G
C-MS and high resolution MS for the plasma generated molecular mixture
. The Si incorporation is similar to that found with CF4 plasmas where
a shorter treatment time resulted in higher Si incorporation. These r
esults indicate that reactor wall-origin contaminations can accompany
plasma treatments, interfere with the the main reaction mechanisms and
create serious problems for achieving the desired surface properties.