Hd. Chandler, CREEP OF COPPER IN THE TEMPERATURE-RANGE 423-623-K, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 169(1-2), 1993, pp. 27-32
The creep of copper in the temperature range 423-623 K was investigate
d and creep curves modelled by combining semi-empirical equations desc
ribing deformation and damage. Previous work has indicated that in thi
s temperature range there is a change in the creep behaviour which is
usually ascribed to a change in deformation mechanism from power law c
reep to power law breakdown. Evidence for this change comes mostly fro
m measurements of steady state creep behaviour which does not account
for the possibility of creep damage during testing. The purpose of thi
s investigation is to demonstrate that if the creep curve is viewed as
a whole, i.e. deformation and damage are considered simultaneously, t
he transition in behaviour can just as well be described in terms of a
single deformation mechanism with a change in the dominant fracture m
echanism.