DSC APPLICATION FOR CHARACTERIZATION OF UREA - FORMALDEHYDE CONDENSATES

Curing process was investigated for a variety of urea/formaldehyde (UF ) resin adhesives suitable for particle boards and/or plywoods using D SC in anisothermal mode. In spite of the very different origins of the adhesives (both commercial and laboratory made) several common featur es in their thermal behaviour are noticed. The maximum curing reaction rate was detected in the range of 80-85-degrees-C. Elimination of for maldehyde was observed at 105-150-degrees-C. At temperatures higher th an 150-degrees-C thermal decomposition of methylene linkage takes plac e which affects the mechanical properties of the adhesives. According to our results a good compromise can be found between product quality and curing rate (production efficiency) on the one hand, and environme ntal protection (low formaldehyd emission) on the other.