ADHESION MEASUREMENT OF THIN METAL-FILMS BY SCRATCH, PEEL, AND PULL METHODS

Scratch, peel, and pull methods for adhesion measurement were applied to deposited thin film/solid substrate combinations. Scatter in the ex perimental data was observed and its origin is discussed. The interfac e between the thin film and the substrate was investigated by transmis sion electron microscopy (TEM), energy dispersive spectroscopy (EDS), and Auger electron spectroscopy (AES), and the correlation of the inte rface structure with the adhesion strength was investigated. Ion bomba rdment and heat treatment were carried out to enhance the adhesion. Ac cumulation of bombarding gas ions at the interface was observed and th e role of ion bombardment in improving adhesion is considered.