DAMAGE ANALYSIS OF THERMOPIEZOELECTRIC PROPERTIES .2. EFFECTIVE CRACKMODEL

Having completed the general formulation for temperature, heat flow, d isplacement, electric potential and displacements and mechanical stres ses of a piezoelectric material as presented in part I of this work, p art II is concerned with a generalized self-consistent approximate met hod for determining the thermoelectroelastic properties of piezoelectr ic materials weakened by microcracks. A representative area element is adopted; it contains a microcrack surrounded by an elliptic matrix in a solid with effective properties, Numerical results are given for a piezoelectric BatiO(3) ceramic. The effective conductivity and effecti ve modulus are found to decrease with increasing crack density.