A method for identifying void shrinkage mechanism experimentally is pr
esented. We treat the void shrinkage on the bonded interface during so
lid state diffusion bonding of similar metals. The voids are arranged
at regular intervals. The experimental results were analysed by log(T/
t(s)) vs (1/T) and log t(s) vs log P plots, where T is the absolute te
mperature, P the compressive stress, t(s) is the time taken to attain
the void shrinkage of a certain volume DELTAV. We obtained t(s) by mea
suring a certain growth of bonded area DELTAS replaced by DELTAV. Even
if DELTAS is adopted, we can identify the transition of the dominant
mechanism by slopes of those plots. As a result, interface self-diffus
ion, volume self-diffusion and power law creep were experimentally ide
ntified as fundamental mechanisms which contribute to the void shrinka
ge process during diffusion bonding of metals.