Ys. Chou et Dj. Green, SILICON-CARBIDE PLATELET ALUMINA COMPOSITES .3. TOUGHENING MECHANISMS, Journal of the American Ceramic Society, 76(8), 1993, pp. 1985-1992
This is the last part of a series of papers on the processing and frac
ture behavior of SiC-platelet/Al2O3 composites. The objective of this
paper was to identify the mechanisms involved in the toughening proces
s. A hot-pressed composite with a SiC volume fraction of 0.3 was chose
n as the model system for study. Based on microstructural observations
, crack deflection and grain bridging were both identified as possible
toughening mechanisms and were further investigated. A modified two-d
imensional crack deflection model is presented to account for the anis
otropic microstructure in hot-pressed platelet composites, in which pr
eferred platelet orientation was present. Relative toughness values we
re predicted for two crack propagation directions assuming crack defle
ction is the toughening mechanism. Fracture toughness measurements for
specific crack directions were made using a bridge indentation techni
que. The correlation of experimental results with theoretical predicti
ons is discussed. To distinguish the effect of grain bridging from cra
ck deflection, an in situ observation of crack growth was conducted. T
he results showed no distinct rising T-curve behavior for cracks in th
e size range 80 to 500 mum. Measurement of fracture surface roughness
was also made and the implications are discussed. The results indicate
that crack deflection is the dominant toughening mechanism in the SiC
-platelet/Al2O3 composites studied herein.