Sensor design and fabrication using industrial IC technologies has the
advantages of batch fabrication and on-chip interface circuitry. Sens
ors made by CMOS or bipolar IC technology have been demonstrated for m
agnetic, temperature and radiation measurands. Certain thermal, mechan
ical and chemical sensors can be realized by combining IC technologies
with additional, compatible processing. We distinguish the methods of
multiple project wafers, single project wafers, post-processing IC ch
ips or wafers, and IC fabrication merged with sensor processing perfor
med before, after, and in-between the regular IC processing steps. Thi
s paper is focused on sensor prototypes realized by industrial CMOS IC
technology with post-processing micromachining. Examples include ther
mally excited acoustic resonators, thermoelectric gas flow, infrared,
and power sensors, and a thermal conductivity sensor.