Aa. Iliadis et al., Ohmic contacts to p-6H-SiC using focused ion-beam surface-modification andpulsed laser epitaxial TiN deposition, APPL PHYS L, 73(24), 1998, pp. 3545-3547
The development of low-resistance Ohmic metallizations to p-type 6H-SiC, us
ing a focused ion-beam (FIB)-Ga surface-modification and ex situ pulsed las
er (PLD) epitaxial TiN deposition without further annealing, is reported. T
he FIB-Ga surface-modification and PLD epitaxial TiN metallizations showed
a minimum value of contact resistance of 4.4 X 10(-5) Ohm cm(2) at an ion d
ose and energy of 5.0 X 10(16) ions/cm(2) and 20 keV, respectively. Auger a
nalysis data indicated well-defined interfaces between the metal and the se
miconductor, and a significant subsurface Ga concentration. (C) 1998 Americ
an Institute of Physics. [S0003-6951(98)01450-8].