A novel method has been proposed for monolayer deposition of Ge on the
clean Si surface. The method is based on alternating and repeated exp
osures of the surface to germanium tetrachloride and atomic hydrogen.
The former results in self-limiting adsorption of precursors on the Si
surface, and the latter in extraction of surface-terminating Cl from
the precursor-adsorbed Si surface. It has been confirmed experimentall
y that Ge can be deposited uniformly at one-monolayer thickness on the
Si(100) surface using this metod.