HIGH-POWER-DENSITY AND HIGH-EFFICIENCY ATOMIC-PLANAR-DOPED ALGAAS INGAAS QUANTUM-WELL POWER HIGH-ELECTRON-MOBILITY TRANSISTORS FOR 2.4 V MEDIUM-POWER WIRELESS COMMUNICATION APPLICATIONS/
Yl. Lai et al., HIGH-POWER-DENSITY AND HIGH-EFFICIENCY ATOMIC-PLANAR-DOPED ALGAAS INGAAS QUANTUM-WELL POWER HIGH-ELECTRON-MOBILITY TRANSISTORS FOR 2.4 V MEDIUM-POWER WIRELESS COMMUNICATION APPLICATIONS/, JPN J A P 1, 36(3B), 1997, pp. 1856-1861
A high-power-density and high-efficiency molecular-beam-epitaxy-grown
atomic-planar-doped AlGaAs/InGaAs quantum-well power high-electron-mob
ility transistor (HEMT) was developed for low-voltage medium-power wir
eless communication applications. The HEMT exhibited a maximum drain c
urrent of 420 mA/mm and a maximum transconductance of 275 mS/mm. A two
-dimensional electron gas with a high sheet charge density and a high
electron mobility in the InGaAs quantum well contributed to the high c
urrent density and high transconductance of the HEMT and enhanced the
device power performance at low operating voltage. An output power den
sity of 177 mW/mm and a power-added efficiency of 61% were achieved by
the 2 mm HEMT at a drain voltage of 2.4 V and a frequency of 900 MHz.
At 2.1 V drain voltage and 2.4 GHz, frequency, the device demonstrate
d an output power of 24.4 dBm and a power-added efficiency of 57.4%. A
n adjacent channel leakage power of -55 dBc was attained for the 1.9-G
Hz pi/4-shifted quadrature phase shift keying modulation when the outp
ut power was 22.2 dBm and the drain voltage was 2.4 V.