Development of joining technology for Be/Cu-alloy and Be/SS by HIP

Joining of Be/DSCu and Be/SS by using HIP technique with and without variou s interlayers were investigated, as a screening test for selecting optimum joining method and conditions. Metallurgical observation and shearing tests were performed for basic characterization of the bonded joints. For Be/DSC , the use of Ag interlayer with 700 degrees C HIP. temperature would be a p rime candidate if Cd formation under neutron irradiation would not seriousl y affect plasma operation and joint performance. Other than the Ag interlay er, a Cr/Cu interlayer gave relatively high joint strength in the present s creening test. The lower HIP temperature, 550 degrees C, for this joint con tributes to prevent sensitization of stainless steel (SS) structural materi al. As for Be/SS, the highest joint strength was obtained with a Ti interla yer. The HIP temperature of 800 degrees C or a little higher would be appli ed for this joint to avoid SS sensitization. (C) 1998 Elsevier Science B.V. All rights reserved.