The effect of bonding and bakeout thermal cycles on the properties of copper alloys irradiated at 100 degrees C

Tensile specimens of GildCop(TM) Al25, CuCrZr and CuNiBe alloys were given various heat treatments corresponding to solution anneal, prime ageing and bonding thermal treatment. Additional specimens were re-aged and given. rea ctor bakeout treatment at 350 degrees C for 100 h. Specimens were neutron i rradiated at 100 degrees C to a dose level of similar to 0.3 dpa in the DR- 3 reactor, and post-irradiation tensile tests, electrical resistivity, and microstructural examination were performed. The main effect of the bonding thermal cycle heat treatment was a slight decrease in strength of the CuCrZ r and CuNiBe alloys, while strength of the Al25 remained almost unaltered. The post-irradiation tests at 100 degrees C revealed the greatest loss of d uctility occurred in the CuCrZr alloy. Irradiation caused a significant red uction in the electrical resistivity of the CuNiBe and a noticeable increas e in the case of the CuCrZr, with only a minor change in the Al25 alloy. (C ) 1998 Published by Elsevier Science B.V. All rights reserved.