Intersonic crack growth in bimaterial interfaces: An investigation of crack face contact

Citation
Y. Huang et al., Intersonic crack growth in bimaterial interfaces: An investigation of crack face contact, J MECH PHYS, 46(11), 1998, pp. 2233-2259
Citations number
29
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
ISSN journal
00225096 → ACNP
Volume
46
Issue
11
Year of publication
1998
Pages
2233 - 2259
Database
ISI
SICI code
0022-5096(199811)46:11<2233:ICGIBI>2.0.ZU;2-7
Abstract
Steady-state intersonic interfacial crack growth accounting for crack face contact is analyzed. The results clearly predict the essential features of experimental observations based on two different but complementary optical techniques and high speed photography. The solution features a large scale contact zone and two distinct traveling shock waves, one emanating from the crack tip and the other from the end of the contact zone. In addition, the solution predicts a non-zero energy dissipation rate due to crack face con tact. (C) 1998 Elsevier Science Ltd. All rights reserved.