The characterization of defects produced during self-annealing implantation
of P+ ions in silicon is of great interest for the realization of good qua
lity pn junctions in silicon and to understand the peculiarity of beam-soli
d interactions occurring during implantation performed under the conditions
of rather high current and power density. High-resolution electron hologra
phy is employed here to study the three-dimensional configuration of nanome
tre-size voids obtained by P+ ion bombardment of a silicon wafer. Reconstru
cted phase difference information has been used to obtain maps in which the
phase distribution gives a qualitative topography of the cavity shape as w
ell as quantitative measurements of the depth variations.