Electroplating bath control for copper interconnects

Authors
Taylor, T Ritzdorf, T Lindberg, F Carpenter, B LeFebvre, M
Citation
T. Taylor et al., Electroplating bath control for copper interconnects, SOL ST TECH, 41(11), 1998, pp. 47
Citations number
13
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLID STATE TECHNOLOGY
ISSN journal
0038111X → ACNP
Volume
41
Issue
11
Year of publication
1998
Database
ISI
SICI code
0038-111X(199811)41:11<47:EBCFCI>2.0.ZU;2-L
Abstract
Electroplating bath composition prays a significant role in deposited coppe r film properties. Methods were developed to replenish prating bath additiv es depleted while depositing copper on semiconductor substrates under condi tions simulating high-volume wafer fabrication. Advantages and drawbacks of the analytical methods were noted, and a candidate topology for a closed-l oop electrolyte monitoring and control system was proposed.