Automation, integration, and data management for the back end

A comprehensive solution to the demanding automation and integration needs of test, assembly, and packaging - semiconductor manufacturing's back end - is essential to improving fab productivity. From extensive experience with field-proven automation systems and customer feedback, here is a proposed architecture for Mure test, assembly, and packaging manufacturing environme nts. This architecture accommodates the qualities most valued by the indust ry, such as modifiability, integration ability, availability, time-to-marke t, and others. It is based an state-of-the art software and accepted standa rds, and it incorporates a built-in evolution path with defined "quanta" of user benefits and functionalities.