Preparation of thin film resistors with low resistivity and low TCR by heat treatment of multilayered Cu/Ni deposits

Authors
Ishikawa, M Enomoto, H Mikamoto, N Nakamura, T Matsuoka, M Iwakura, C
Citation
M. Ishikawa et al., Preparation of thin film resistors with low resistivity and low TCR by heat treatment of multilayered Cu/Ni deposits, SURF COAT, 110(3), 1998, pp. 121-127
Citations number
14
Categorie Soggetti
Material Science & Engineering
Journal title
SURFACE & COATINGS TECHNOLOGY
ISSN journal
02578972 → ACNP
Volume
110
Issue
3
Year of publication
1998
Pages
121 - 127
Database
ISI
SICI code
0257-8972(199812)110:3<121:POTFRW>2.0.ZU;2-4
Abstract
Thin Cu-Ni alloy film resistors were prepared by different methods using bo th electroless plating and electrodeposition. Alloy composition, structure and electrical properties (resistivity and TCR) were examined as a function of plating conditions. Low resistivity and low TCR performance were achiev ed by heating the multilayered Cu/Ni film deposited on electroless Cu. (C) 1998 Elsevier Science S.A. All rights reserved.