Composite TiN-Ni thin films were deposited by direct-current (DC) magnetron
sputter ion-plating from an alloy Ti-48 at% Ni target in a mixture of argo
n and nitrogen gases at a total pressure of 0.1 Pa onto glass and stainless
steel substrates heated to temperatures higher than 250 degrees C. The fil
ms deposited at the nitrogen flow Q(N2) greater than or equal to 6.4 seem c
onsisted of a mixture of delta-TiN and fee nickel phases. The effects of ne
gative substrate bias and substrate temperature on the crystal structure of
the films were studied. The substrate bias of - 200 V resulted in improved
crystallization of films and a smaller difference in size between the TIN
and nickel grains, as compared with films deposited onto substrates at floa
ting potential. It was possible to vary the crystal grain size of both phas
es by varying the substrate temperature in the range 270-430 degrees C. The
maximum hardness measured in the films was 10.5 GPa. It is expected that t
he hardness can be increased by decreasing the content of nickel. (C) 1998
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