Optical effects during rapid thermal diffusion

Citation
S. Noel et al., Optical effects during rapid thermal diffusion, J ELEC MAT, 27(12), 1998, pp. 1315-1322
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
27
Issue
12
Year of publication
1998
Pages
1315 - 1322
Database
ISI
SICI code
0361-5235(199812)27:12<1315:OEDRTD>2.0.ZU;2-H
Abstract
The formation of n(+)-p or n(+)-p-p(+) junctions by rapid thermal diffusion of phosphorus or co-diffusion of phosphorus and aluminum into silicon is o pening new possibilities for low-cost and environmentally safe solar cell p roduction. In this work, we analyze the influence of the higher energetic p art of the lamp spectrum on phosphorus diffusion, and the impact of evapora ted aluminum for back surface field formation during a P-Al co-diffusion st ep. The diffusion of phosphorus from doped glass films spun onto monocrysta lline silicon material in various furnace configurations with front, back, or double sided heating is studied to investigate the influence of the radi ation spectra on the dopant profiles. The experiments reveal a relation of the dopant profile to the amount of ultraviolet radiation reaching the surf ace. Therefore, a modified RTP-System is used for further investigations to demonstrate the influence of the ultraviolet (UV) light on the diffusion p rofiles. These experiments clearly show that the influence of the UV light is mainly on the densification of the spin-on-glass and not on diffusion ki netics in silicon. Furthermore, the simultaneous formation of a back surfac e field is of special interest for solar cells. Earlier studies of the simu ltaneous diffusion of phosphorus and aluminum in order to form a n(+)-p-p() structure show (compared to a single phosphorus diffusion) deeper n(+) em itters. Using glass densification experiments on such samples, a correlatio n was found between the decrease in emissivity on the aluminum-coated part of the wafer and the increase in temperature, which seems to be responsible for the deeper profiles.