Microstructure changes in Sn-3.5Ag solder alloy during creep

Authors
Igoshev, VI Kleiman, JI Shangguan, D Lock, C Wong, S Wiseman, M
Citation
Vi. Igoshev et al., Microstructure changes in Sn-3.5Ag solder alloy during creep, J ELEC MAT, 27(12), 1998, pp. 1367-1371
Citations number
8
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
27
Issue
12
Year of publication
1998
Pages
1367 - 1371
Database
ISI
SICI code
0361-5235(199812)27:12<1367:MCISSA>2.0.ZU;2-A
Abstract
Experimental data on behavior of the Sn-3.5Ag solder alloy microstructure d uring tensile creep deformation and subsequent failure is described. Depend ing upon applied stress, the nucleation and further development of grain bo undary defects that start at an earlier stage in the deformation process wa s revealed. A discussion is presented on possible micromechanisms of the cr ack formation process.