The compressive creep behaviours of a silicon nitride ceramic densified wit
h yttria and alumina and of the same material containing 10 wt% SiC nanopar
ticles are compared in the 1250-1450 degrees C temperature range under stre
sses ranging from 45 to 180 MPa. The stress exponents are similar to 0.8 an
d 1 and the apparent activation energies are 514 and 590 kJ mol(-1) for the
monolith and the composite, respectively. No signs of cavitation are obser
ved. For both materials grain boundary sliding accommodated by diffusion th
rough the intergranular glass phase is considered as the primary steady-sta
te creep mechanism. The higher creep resistance of the composite is connect
ed to the presence of intergranular SiC nanoparticles which limit grain bou
ndary sliding and to the difference in chemical composition of the intergra
nular glass phase.