Laser micromachining with a frequency doubled Nd:YAG laser (532 nm) can rep
lace more complex microlithographic processes for rapid turnaround in the d
evelopment of prototype application-specific integrated circuits. Plasma po
lymerization is a rapid, dry, environmentally friendly process that yields
crosslinked pinhole-free films. Plasma polymerized films of ethylene and an
additional gas [PP(gas/E)] were investigated for their micromachining pote
ntial. The deposition rates, molecular structures, physical properties and
optical properties of the polymers were characterized. PP(Ar/E), with relat
ively little oxygen and no nitrogen, with superior substrate adhesion and w
ith no debris generated on laser micromachining was chosen as the optimal l
aser micromachining film.; The PP(Ar/E) coefficient of optical absorption a
t 532 nm (alpha(532)) related to unsaturated group concentration, increased
with the ratio of plasma power to ethylene mass flow rate [W/F-m(E)]. alph
a(532) reached an asymptote of 2.9 mu m(-1) at high W/F-m(E) and could be e
nhanced slightly using postpolymerization ultraviolet exposure. The optimum
conditions were using Ar/E=1/1 and 75 W to produce a 0.6 mu m thick film f
or micromachining at 2 J/cm(2) focused 0.25 mu m beneath the surface. The l
aser pulse in a 1.2 mu m thick film was not fully developed at 2 J/cm(2) an
d exhibited rounded corners at 4 J/cm(2) indicating that multiple low energ
y pulses would be preferable. complicated and densely packed pattern with s
everal different pulse sizes in which neighboring holes from pulses in clos
e proximity do not merge was accurately reproduced in PP(Ar/E) using laser
micromachining. (C) 1998 American Vacuum Society. [S0734-211X(98)00906-8].