Recently, we have shown that small trenches in amorphous carbon films can b
e produced by a field induced local oxidation with a voltage biased cantile
ver tip in a scanning force microscope. The depth of the holes and the tren
ches corresponds to the total thickness of the carbon film while the width
was found to be as small as 30 nm. Amorphous carbon films as resist masks f
or lithography show some advantageous properties, e.g., the stability again
st halogen plasma etching, negligible chemical reactivity with most substra
tes and the possibility of removing the mask by oxygen reactive ion etching
. In this article; we demonstrate the transfer of the carbon patterns into
metal films by argon ion beam etching. By this new method, we produced 10-n
m-wide trenches in thin AuPd films. Furthermore, we made small gaps in narr
ow AuPd lines which have been predefined by conventional e-beam lithography
. In order to control and minimize the width of the gaps, the resistance of
the conducting lines was controlled in situ during ion beam etching. (C) 1
998 American Vacuum Society. [S0734-211X(98)13506-0].