Nitride based high power devices: Design and fabrication issues

Citation
Zz. Bandic et al., Nitride based high power devices: Design and fabrication issues, SOL ST ELEC, 42(12), 1998, pp. 2289-2294
Citations number
11
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
SOLID-STATE ELECTRONICS
ISSN journal
00381101 → ACNP
Volume
42
Issue
12
Year of publication
1998
Pages
2289 - 2294
Database
ISI
SICI code
0038-1101(199812)42:12<2289:NBHPDD>2.0.ZU;2-Y
Abstract
We have modeled the breakdown voltage, critical current density and maximum operating frequency of several nitride based high power and high temperatu re electronic devices. It is found that the minority carrier recombination lifetime and the critical field for electric breakdown are important model parameters which influence device design and performance. Planar geometry G aN Schottky devices were fabricated and used to experimentally estimate the se important parameters. Current-vol rage measurements have indicated the i mportance of the non-planar geometries for achieving large breakdown voltag es. The minority carrier (hole) diffusion length and recombination lifetime have been measured using the electron beam induced current technique. The measured hole lifetime of 7 ns and estimate for the critical field indicate the possibility of AlGaN based thyristor switch devices operating at 5 kV with current densities up to 200 A/cm(2) and at frequency above 2 MHz. The GaN structural and optical material quality as well as processing requireme nts for etching are also discussed. (C) 1998 Published by Elsevier Science Ltd. All rights reserved.