Preparation and electrical resistance characteristics of electroless copper-nickel alloy deposits

Studies have been made of art electroless copper-nickel-phosphorus alloy fr om a citrate complex bath using hypophosphite as reducing agent and electro less copper-nickel binary alloy from a triethanolamine complex bath using f ormaldehyde as reducing agent With an increase in copper content of alloy, the specific resistance of deposit decreased The TCR of copper-nickel-phosp horus alloy increased remarkably because of the crystallization of Ni3P aft er hear treatment. But the increase in TCR of copper-nickel binary alloy wa s moderate and not so striking as for the phosphorus containing alloy.