Active-passive potential steps have been applied during continuous microind
entation into 300 mu m thick Fe3%Si sheets exposed to 1 M H2SO4. First, sam
ples were allowed to deflect in the indentation direction whereby the inden
ter penetration changed due to local metal dissolution and sample deflectio
n resulting from passive film stress induced bending. Samples were then con
strained to eliminate stress induced deflection. A distinct difference betw
een the indentation curves for the above two types of tests allowed separat
ion of the effects of film stress and local dissolution. Indenter tip displ
acement correlated with the current behavior and was consistent with the sa
lt film evolution and resulting electrostrictive film stress. A theoretical
model allows estimates of the time dependent film thickness (3.5 mu m at m
aximum) and electrostrictive film stress (330 MPa at maximum). (C) 1998 Els
evier Science Ltd. All rights reserved.