P-type MOS capacitors fabricated in two bipolar processes were examined for
ionizing radiation-induced threshold voltage shifts as a function of total
dose, dose rate, temperature and bias. Hydrogen passivation of acceptor im
purities near the Si surface was observed through decreases in the Si capac
itance. The reduction in net electrically active dopants shifts the thresho
ld voltage negative with total dose. The relative contribution of dopant pa
ssivation to the radiation-induced threshold voltage shift is most signific
ant for irradiations performed under zero bias above 100 degrees C. For zer
o bias, dopant passivation and densities of radiation-induced interface tra
ps and net positive oxide trapped charge all exhibit true dose rate and tim
e dependent effects. A positive gate bias during irradiation eliminates the
dose rate dependence. High dose rate irradiation at elevated temperatures
enhances oxide degradation while simultaneously accelerating the annealing
of damage. The enhancement in interface trap formation is greater than that
of net positive oxide trapped charge and occurs over a greater range of te
mperatures. The temperature dependence of dopant passivation indicates that
hydrogen transport through the oxides is accelerated with temperature. The
se results strongly suggest that metastably trapped charge in the oxide bul
k reduces high dose rate degradation at room temperature by inhibiting the
transport of holes and H+ ions.