Kinetic approach for epoxy resins cured with diaminodiphenyl sulfone undernon-isothermal conditions

Citation
Kc. Cheng et al., Kinetic approach for epoxy resins cured with diaminodiphenyl sulfone undernon-isothermal conditions, J APPL POLY, 71(5), 1999, pp. 721-728
Citations number
24
Categorie Soggetti
Organic Chemistry/Polymer Science","Material Science & Engineering
Journal title
JOURNAL OF APPLIED POLYMER SCIENCE
ISSN journal
00218995 → ACNP
Volume
71
Issue
5
Year of publication
1999
Pages
721 - 728
Database
ISI
SICI code
0021-8995(19990131)71:5<721:KAFERC>2.0.ZU;2-7
Abstract
The curing reactions of epoxy resin basing on diglycidyl ether bisphenol A (DGEBA) with 4,4'-diaminodiphenyl sulfone (DDS) were investigated with a di fferential scanning calorimeter and gel permeation chromatography. Based on the generating function method and the Monte Carlo simulation procedure, k inetic models for both isothermal and nonisothermal curing conditions were proposed. The apparent activation energy of curing reactions was found to b e 14.9 Kcal/mol by the thermal analysis. According to our kinetic models, g el points, the profiles of epoxy conversion, and the molecular weights of p olymers were calculated. Good agreement is obtained between the model predi ctions and experimental data. (C) 1999 John Wiley & Sons, Inc.