For measuring sputtering yields with MeV heavy ions only low current densit
ies can be used in order to avoid excessive target heating. Consequently se
lf-cleaning of the target surface during the irradiation cannot be achieved
and a contamination free surface has to be maintained by means of UHV cond
itions. A UHV-setup including a differential pumping system has been design
ed and operated at a vacuum of 10(-10) mbar during experiments. Sputtered p
articles were collected on Si catchers and subsequently measured by two dif
ferent surface analysis methods: Total Reflection X-Ray Fluorescence (TXRF)
, and Heavy Ion Rutherford Backscattering Spectrometry (HI-RBS), In-situ su
rface cleaning by 8 keV Xe ions as well as online monitoring by ERDA were f
ound to be essential. With sufficient precautions on the surface conditions
reproducible sputtering yields were obtained. First measurements for 230 M
eV Au ions on Au, Zr, and Ti targets are presented. (C) 1998 Elsevier Scien
ce B.V. All rights reserved.