Si3N4 thin films were deposited with atomic layer control on Si(100) substr
ates using sequential surface chemical reactions. The Si3N4 film growth was
accomplished by separating the binary reaction 3SiCl(4)+4NH(3)Si(3)N(4)+12
HCl into two half-reactions. Successive application of the SiCl4 and NH3 ha
lf-reactions in an ABAB... sequence produced Si3N4 deposition at substrate
temperatures between 500 and 900 K and SICl4 and NH3 reactant pressures of
1-10 Torr. Transmission Fourier transform infrared (FTIR) spectroscopy stud
ies indicated that the SiC4 and NH3 half-reactions were complete and self-l
imiting at substrate temperatures greater than or equal to 700 K. In situ s
pectroscopic ellipsometry monitored the Si3N4 him growth versus substrate t
emperature and reactant exposure time. The maximum Si3N4 deposition rate pe
r AB cycle was 2.45 Angstrom per AB cycle at 700 K for reactant exposures >
10(10) L. The Si3N4 deposition rate decreased slightly in the temperature
range 700-900 K. Rutherford backscattering measurements revealed an Si/N ra
tio of 1:1.35 as expected for stoichiometric Si3N4 deposition. The surface
topography of the Si3N4 films measured with atomic force microscopy (AFM) w
as nearly identical to the initial Si(100) substrate indicating extremely s
mooth and conformal Si3N4 deposition. (C) 1998 Elsevier Science B.V. All ri
ghts reserved.