Thin films of silicon-containing polymers were studied to investigate chang
es in surface composition and morphology on exposure to an oxygen plasma. F
or low molecular weight poly(pentamethyldisilylstyrene) (P(PMDSS)), a retic
ulated structure was observed by atomic force microscopy (AFM) that could l
imit future lithographic applications of these materials. The reticulations
were of approximately 1 mu m in width and 5 mu m in length, though a highe
r molecular weight polymer resulted in smaller feature sizes. In polysilane
polymers containing silicon in the backbone and molecular weights signific
antly larger than the entanglement molecular weight, the feature dimensions
were even smaller. Films etched at lower temperature (0 degrees C) display
ed none of the reticulated morphology, retaining instead the smooth appeara
nce of pre-etched films. It was found by X-ray photoelectron spectroscopy (
XPS) and Auger electron spectroscopy (AES) that a thin (<100 Angstrom) laye
r of SiOx formed on the surface of all of the studied silicon-containing po
lymer films. Appearance of the reticulated morphology required the combined
presence of heating, oxygen plasma, and silicon in the polymer. The reticu
lated structures are believed to result from the destabilization of the thi
n films as they undergo the transition from a nonpolar organosilane to a po
lar oxide.