Shaped electronic substrates in low-temperature co-fired ceramics

This paper described a process for making shaped electronic substrates from low-temperature co-fired ceramic (LTCC) technology. Such substrates may be shaped into non-planar structures, carrying electronic interconnections, b oth internally and on both external surfaces. The substrate form can be con tinuously curved, or bent in two or three planes, with linked flat areas ca rrying electronic components. Substrates can be bent in curves down to 1 mm radius, with tracking passing around the curves without physical or electr ical discontinuity. This paper describes the methods of shaping the substra tes, the design rules that need to be followed, and their limitations. Fina lly, examples of applications of three-dimensional electronic substrates ar e given.