Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits

Authors
Krishnamoorthy, AV Chirovsky, LMF Hobson, WS Leibenguth, RE Hui, SP Zydzik, CJ Goossen, KW Wynn, JD Tseng, BJ Lopata, J Walker, JA Cunningham, JE D'Asaro, LA
Citation
Av. Krishnamoorthy et al., Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits, IEEE PHOTON, 11(1), 1999, pp. 128-130
Citations number
23
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
IEEE PHOTONICS TECHNOLOGY LETTERS
ISSN journal
10411135 → ACNP
Volume
11
Issue
1
Year of publication
1999
Pages
128 - 130
Database
ISI
SICI code
1041-1135(199901)11:1<128:VSLFBT>2.0.ZU;2-6
Abstract
We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via hip-chip bonding.