The present work has been aimed at optimizing a chemical oxidation process
of copper substrates for microelectronics applications (adhesion improvemen
t at the polymer/metal interface) Analysis of the so-formed oxide films was
carried out by low-energy electron-induced x-ray spectrometry (LEEIXS) and
x-ray photoelectron spectrometry (XPS) Considerable information was obtain
ed about chemical composition and thickness of oxide films and correlated w
ith the elaboration parameters (temperature of the oxidizing bath. treatmen
t time ...).