Special section on application of fracture mechanics in electronic packaging - Preface

Authors
Citation
Dt. Read, Special section on application of fracture mechanics in electronic packaging - Preface, J ELEC PACK, 120(4), 1998, pp. 321-321
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF ELECTRONIC PACKAGING
ISSN journal
10437398 → ACNP
Volume
120
Issue
4
Year of publication
1998
Pages
321 - 321
Database
ISI
SICI code
1043-7398(199812)120:4<321:SSOAOF>2.0.ZU;2-P