Adhesion and reliability of polymer/inorganic interfaces

The reliability of microelectronic components is profoundly influenced by t he interfacial fracture resistance (adhesion) and associated progressive de bonding behavior. In this study we examine the interfacial fracture propert ies of representative polymer interfaces commonly found in microelectronic applications. Specifically, interface fracture mechanics techniques are des cribed to characterize adhesion and progressive bebonding behavior of a pol ymer/metal interface under monotonic and cyclic fatigue lending conditions. Cyclic fatigue debond-growth rates were measured from similar to 10(-11) t o 10(-6) m/cycle and found to display a power-law dependence on the applied strain energy release rate range, Delta G. Fracture toughness test results show that the interfaces typically exhibit resistance-curve behavior, with a plateau interface fracture resistance, G(ss), strongly dependent on the interface morphology and the thickness of the polymer layer. The effect of a chemical adhesion promoter on the fracture energy of a polymer/silicon in terface was also characterized Micromechanisms controlling interfacial adhe sion and progressive debonding are discussed in terms of the prevailing def ormation mechanisms and related to interface structure and morphology.