Comparison of TiN deposition by rf magnetron sputtering and electron beam sustained arc ion plating

Citation
Sq. Xiao et al., Comparison of TiN deposition by rf magnetron sputtering and electron beam sustained arc ion plating, THIN SOL FI, 334(1-2), 1998, pp. 173-177
Citations number
7
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
334
Issue
1-2
Year of publication
1998
Pages
173 - 177
Database
ISI
SICI code
0040-6090(199812)334:1-2<173:COTDBR>2.0.ZU;2-#
Abstract
TiN films were deposited both by electron beam (EB) sustained Ti are ion pl ating and by reactive magnetron sputtering in nitrogen atmosphere. Although the optical emission measurement revealed totally different features of th e excited species in the two discharges, stoichiometric TiN films were obta ined by both techniques. Different mechanisms of film formation in the two methods were proposed. The crystal structures of the deposited films were c orrelated with the experimental conditions. XPS analysis indicated that the difference of electrical resistivity in the samples prepared by the two te chniques was the result of the difference in the bonding states of Ti in th e films. (C) 1998 Published by Elsevier Science S.A. All rights reserved.