The use of high dose Co+ implantation into hydrogenated amorphous silicon (
a-Si:H) deposited on glass has been investigated for the fabrication of low
resistivity layers and Schottky devices without the need for high temperat
ure thermal processing. Layer resistivities as tow as 10 Ohm/square have be
en achieved for the as-implanted samples and 3 Ohm/square after annealing a
t temperatures up to 500 degrees C. Quality Schottky devices have been fabr
icated for implant doses as low as 10(16) Co+cm(-2).